Methods for Manufacturing an Electronic Module

ABSTRACT

A method for manufacturing an electronic module is disclosed. In an embodiment the method includes providing a passive component having an upper surface of a first area, and electrically and mechanically attaching a first semiconductor chip having a lower surface of a second area that is smaller than the first area to the passive component, wherein the lower surface of the first semiconductor chip is arranged on the upper surface of the passive component, and wherein the first semiconductor chip comprises a vertical field-effect transistor.

This is a continuation application of U.S. application Ser. No.13/232,803, issued on Jun. 30, 2015 as U.S. Pat. No. 9,070,642, entitled“Electronic Module” which was filed on Sep. 14, 2011 and is incorporatedherein by reference.

TECHNICAL FIELD

The present invention relates to methods for manufacturing an electronicmodule.

BACKGROUND

The power supply and voltage regulation for devices such as the centralprocessing unit, the memory or peripheral loads becomes a majorchallenge due to increasing power demands in computing platforms. Highercurrents have to be delivered on ever decreasing available board spacefor the voltage regulator that results in the necessity for higher powerdensity solutions for the voltage regulator. The active and passivecomponents of a power supply or voltage regulator occupy board space andhinder highest-power density solutions. Integrating these active andpassive components into one package and simultaneously providing highcurrents and at the same time meeting efficiency targets and keepingthermal stress low is the major challenge to overcome.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of embodiments and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments andtogether with the description serve to explain principles ofembodiments. Other embodiments and many of the intended advantages ofembodiments will be readily appreciated as they become better understoodby reference to the following detailed description. The elements of thedrawings are not necessarily to scale relative to each other. Likereference numerals designate corresponding similar parts.

FIG. 1 shows a schematic cross-sectional side view representation of anelectronic module according to an embodiment;

FIG. 2 shows a schematic cross-sectional side view representation of apower supply module according to an embodiment;

FIG. 3 shows a schematic cross-sectional side view representation of apower supply module according to an embodiment;

FIG. 4 shows a perspective representation of an inductor moduleaccording to an embodiment;

FIG. 5 shows a perspective representation of a power supply moduleaccording to an embodiment;

FIGS. 6 a and 6 b show perspective top and bottom views of a substratecarrying the semiconductor chips according to an embodiment; and

FIG. 7 shows a perspective view of a power supply module according to anembodiment.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The aspects and embodiments are now described with reference to thedrawings, wherein like reference numerals are generally utilized torefer to like elements throughout. In the following description, forpurposes of explanation, numerous specific details are set forth inorder to provide a thorough understanding of one or more aspects of theembodiments. It may be evident, however, to one skilled in the art thatone or more aspects of the embodiments may be practiced with a lesserdegree of the specific details. In other instances, known structures andelements are shown in schematic form in order to facilitate describingone or more aspects of the embodiments. It is to be understood thatother embodiments may be utilized and structural or logical changes maybe made without departing from the scope of the present invention. Itshould be noted further that the drawings are not to scale or notnecessarily to scale.

In addition, while a particular feature or aspect of an embodiment maybe disclosed with respect to only one of several implementations, suchfeature or aspect may be combined with one or more other features oraspects of the other implementations as may be desired and advantageousfor any given or particular application. Furthermore, to the extent thatthe terms “include”, “have”, “with” or other variants thereof are usedin either the detailed description or the claims, such terms areintended to be inclusive in a manner similar to the term “comprise”. Theterms “coupled” and “connected”, along with derivatives may be used. Itshould be understood that these terms may be used to indicate that twoelements co-operate or interact with each other regardless of whetherthey are in direct physical or electrical contact, or they are not indirect contact with each other. Also, the term “exemplary” is merelymeant as an example, rather than the best or optimal. The followingdetailed description, therefore, is not to be taken in a limiting sense,and the scope of the present invention is defined by the appendedclaims.

The embodiments of an electronic module and a power supply module mayuse various types of semiconductor chips or circuits incorporated in thesemiconductor chips, among them driver circuits, logic integratedcircuits, analog integrated circuits, mixed signal integrated circuits,sensor circuits, MEMS (Micro-Electro-Mechanical-Systems), powerintegrated circuits, chips with integrated passives, etc. Theembodiments may also use semiconductor chips comprising MOS transistorstructures or vertical transistor structures like, for example, IGBT(Insulated Gate Bipolar Transistor) structures or, in general,transistor structures in which at least one electrical contact pad isarranged on a first main face of the semiconductor chip and at least oneother electrical contact pad is arranged on a second main face of thesemiconductor chip opposite to the first main face of the semiconductorchip.

Referring to FIG. 1, there is shown a schematic cross-sectional sideview representation of an electronic module according to an embodiment.The electronic module 10 comprises a first semiconductor chip 2 and apassive component 1, wherein the first semiconductor chip 2 is arrangedon a surface of the passive component 1.

According to an embodiment of the electronic module 10, the firstsemiconductor chip 2 is arranged on or above one of the major surfacesof the passive component 1.

According to an embodiment of the electronic module 10, the firstsemiconductor chip 2 comprises smaller spatial dimensions than thepassive component 1, in particular a major surface of the firstsemiconductor chip 2 is smaller in spatial dimensions than a majorsurface of the passive component 1 and the first semiconductor chip 2 isattached with one of its major surfaces on or above a major surface ofthe passive component 1.

According to an embodiment of the electronic module 10, the firstsemiconductor chip 2 is connected mechanically and electrically to thepassive component 1, in particular the first semiconductor chip 2 isdirectly connected with one of its surfaces to one of the surfaces ofthe passive component 1.

According to an embodiment of the electronic module 10, the electronicmodule 10 further comprises an electronic circuit, wherein the firstsemiconductor chip 2 and the passive component 1 are both part of theelectronic circuit.

According to an embodiment of the electronic module 10, the passivecomponent 1 comprises one or more of an inductor, a capacitor, atransformer, a heat sink, or a chassis component or enclosure component.

According to an embodiment of the electronic module 10, the passivecomponent 1 comprises at least one electrical terminal on one of thesurfaces thereof, in particular on one of the major surfaces thereof,wherein the first semiconductor chip 2 is arranged on or above the atleast one electrical terminal. According to a further embodimentthereof, a contact pad of the first semiconductor chip 2 is directlyelectrically and mechanically connected with the at least one electricalterminal of the passive component 1. According to a further embodimentthereof, the first semiconductor chip 2 is situated, at least in part,directly above the electrical terminal of the passive component 1, inparticular such part of the first semiconductor chip 2, which comprisesthe contact pad, is situated directly above the electrical terminal ofthe passive component 1.

According to an embodiment of the electronic module 10, the electronicmodule 10 further comprises a substrate, the first semiconductor chip 2being arranged on the substrate and the substrate being arranged on orabove the surface of the passive component 1.

According to a further embodiment thereof, the substrate comprises aplate-like rectangular shape comprising two main opposing surfaces.According to an embodiment thereof, the substrate comprises a firstsurface and a second surface and a plurality of through-holes extendingfrom the first surface to the second surface.

According to an embodiment, the substrate comprises a main surfacecomprising spatial dimensions smaller than or equal to the spatialdimensions of the surface of the passive component 1. According to anembodiment, the substrate is arranged directly on and above the surfaceof the passive component 1, in particular in such a way that one sideedge of the substrate is situated directly above one side edge of thepassive component 1.

According to an embodiment of the electronic module 10, the passivecomponent 1 comprises a recess in the surface, the spatial dimensions ofthe recess corresponding to the spatial dimensions of the main surfaceof the semiconductor chip or to the spatial dimensions of the mainsurface of a substrate carrying the semiconductor chip. Thesemiconductor chip or the substrate carrying the semiconductor chip isinserted into the recess of the passive component 1. According to afurther embodiment thereof, the passive component 1 comprises at leastone electrical terminal, in particular an electrical terminal which issituated below the recess. In other words, the bottom of the recess isformed by the electrical terminal or at least a part of the electricalterminal. The electrical terminal can have a flat surface with arectangular shape extending to an edge of the passive component 1.

According to an embodiment of the electronic module 10, the modulecomprises a second semiconductor chip, in particular in such a way thatit is arranged on the before-mentioned substrate.

According to an embodiment of the electronic module 10, the firstsemiconductor chip comprises a transistor structure, in particular avertical field-effect transistor structure or, alternatively, any otherkind of field-effect transistor structure.

According to an embodiment of the electronic module 10, the firstsemiconductor chip and the second semiconductor chip both comprise powertransistors, in particular vertical structured power MOSFETs. Inparticular these two power MOSFET transistors are part of a synchronoushalf-bridge buck converter circuit.

According to an embodiment of the electronic module 10, the modulefurther comprises at least one capacitor, in particular an inputcapacitor and an output capacitor, which, for example, can be part of anelectrical circuit such as a converter circuit, in particular a buckconverter circuit.

According to an embodiment of the electronic module 10, the spatialdimensions of the module correspond to the spatial dimensions of thepassive component 1. In case of an inductor as passive component 1, themain body of the inductor is formed of a ferrite material.

According to an embodiment of the electronic module 10, the modulecomprises or consists of one or more of a power supply module, a switchmode power supply module, a voltage regulator, a DC/DC converter, a buckconverter, a boost converter, an LLC resonant converter, a TTF/ITTFconverter, a phase-shifted ZVS converter, or an H4 converter.

The above-described embodiments make it possible to integrate two powerdevices, namely a high-side MOSFET and a low-side MOSFET of a voltageconverter circuit and a passive component, in particular an inductor,into one single low-parasitic package. Thereby the high-side MOSFET andthe low-side MOSFET are placed on or under the inductor bringing theboard space consumption of active device virtually down to zero. Alsosignificant efficiency improvements can be expected due to reduction ofparasitic stray inductances and parasitic trace resistances. This allowsincreasing switching frequencies up to 1-2 MHz. A further advantage isthat the passive component, in particular in case of an inductor, can beutilized as a heat-sink, since the active devices are mounted directlyon or under the inductor and have a good thermal connection to theinductor itself. In general any large existing component resident in thevicinity of the power conversion structure can be considered as apotential host or substrate for the power devices. As mentioned above,this could also be a transformer, a shared heat-sink, a metal chassis ofa keyboard, an electrolytic capacitor, or chassis or enclosurecomponents.

Referring to FIG. 2, there is shown a schematic cross-sectional sideview representation of a power supply module according to an embodiment.The power supply module 20 of FIG. 2 comprises an electronic circuitcomprising at least one semiconductor chip 22 and at least one inductor21, wherein the semiconductor chip 22 is arranged on a first surface ofthe inductor 21. The indicator 21 is represented here as a main body 21a which can be made of a ferrite material, and inductor windings 21 bembedded within the main body 21 a.

According to an embodiment of the power supply module 20, the inductor21 comprises at least one electrical terminal on the first surface,wherein the semiconductor chip 22 is arranged on the at least oneelectrical terminal, the electrical terminal being connected with theinductor windings 21 b. According to a further embodiment thereof, acontact pad of the semiconductor chip is directly electrically andmechanically connected with the at least one electrical terminal of theinductor 21 wherein a direct connection also includes connecting thechip to the terminal by means of glue or solders.

According to an embodiment of the power supply module 20, the spatialdimensions of the power supply module 20 correspond to the spatialdimensions of the inductor 21 which means that the spatial dimensions ofthe power supply module 20 are defined by the spatial dimensions of theinductor 21 as the biggest part of the power module 20. However, theremight also be applications in which the power supply module is designedslightly larger than the inductor. For example, there may be passives oractives which are too large to be integrated under the inductor so thatthey would be outside of the footprint of the inductor so that in thesecases the spatial dimensions of the power supply module are greater thanthe spatial dimensions of the inductor.

Further embodiments can be formed along the lines of the embodiments andfeatures as described in connection with the electronic module 10 ofFIG. 1.

In the above-described embodiment the at least one electrical terminalof the inductor may also act as a heat-pipe to pull heat generated inthe semiconductor chip in a very efficient way into the inductor coil.The main body 21 a of the inductor 21, which can be fabricated of aferrite material, may act as a thermal mass for the whole assembly. Itis also possible to artificially enlarge one or more of the outersurfaces of the main body 21 a of the inductor by forming regularsurface structures into it in order to conduct the generated heat in anefficient way to the outer atmosphere.

Referring to FIG. 3, there is shown a schematic cross-sectionalrepresentation of a power supply module according to an embodiment. Thepower supply module 30 of FIG. 3 comprises an electronic circuitcomprising a first semiconductor chip 32 and at least one inductor 31,and a substrate 33, wherein the first semiconductor chip 32 is arrangedon the substrate 33 and the substrate 33 is arranged on a surface of theinductor 31.

According to an embodiment of the power supply module 30, the substrate33 is arranged in a recess of the inductor 31.

According to an embodiment of the power supply module 30, the electroniccircuit comprises or consists of a voltage regulator circuit, a DC/DCconverter circuit, a buck converter circuit, a boost converter circuit,an LLC resonant converter circuit, a TTF/ITTF converter circuit, aphase-shifted ZVS converter circuit, or an H4 converter circuit.

Further embodiments can be formed along the embodiments as described inconnection with the electronic module of FIG. 1.

Referring to FIG. 4, there is shown a perspective view of an inductormodule 40 according to an embodiment. The inductor module 40 of FIG. 4can be utilized as a passive component of the embodiments previouslydescribed in connection with FIGS. 1-3.

The inductor module 40 comprises a main body 41 made of a ferritematerial. It can be seen that in the upper main surface of the main body41 a plate-like rectangular recess 41 a is formed having spatialdimensions so that a substrate of similar spatial dimensions can beinserted into it. The recess 41 a extends to one of the side edges ofthe surface of the main body 41. This surface is normally designated asthe bottom surface of the inductor module 40 as the module is normallymounted upside down with this surface onto a PCB board. At the bottom ofthe recess 41 a a plate-like input connector 42 is attached to thesurface of the main body 41 wherein at the edge of the surface the inputconnector 42 is bent downwards to a vertical plate-like portion of theinput connector 42 attached to one of the side faces of the main body41. The upper, horizontal plate-like portion of the input connector 42is inserted into a further recess formed into the bottom face of therecess 41 a so that a substrate can be inserted into the recess 41 a ina way that the bottom surface of the substrate is in direct mechanicaland electrical connection with the input connector 42. The inductormodule 40 also comprises an output connector 43 which is attached to themain body 41 in almost the same way as the input connector 42, i.e., theoutput connector 43 comprising a flat horizontal portion inserted in arecess formed in the upper surface of the main body 41 and a verticalportion (not shown) attached to another side face of the main body 41and connected with the horizontal portion of the output connector 43 bya bent-down portion.

The inductor module 40 of FIG. 4 can be a simple, low inductance typewhich contains a flat copper strip (not shown) that passes through thecenter of the ferrite main body 41. Other inductor modules, such asthose schematically shown in FIG. 2, have larger inductance values andcontain a true copper coil.

Referring to FIG. 5, there is shown a perspective view of a power supplymodule according to an embodiment. The power supply module 50, as shownin FIG. 5, is fabricated by providing an inductor module 52, such asthat shown as inductor module 40 in FIG. 4, and inserting a substrate 51into a recess 52 a formed into the surface of a main body of theinductor 52. The substrate 51 comprises a high-side MOSFET transistor51.1 (Vin) and a low-side MOSFET transistor 51.2 (Gnd) wherein the pairof MOSFET transistors is connected in a synchronous buck converterconfiguration. The MOSFET transistors 51.1 and 51.2 are configured tohave direct vertical connection to the input connector 52.1 of theinductor 52. In this configuration the current passes verticallydirectly through the semiconductor die. The power supply module 50 alsocomprises an output connector 52.2 of the inductor 52. The outputconnector 52.2 is formed in a similar way as the input connector 52.1.The upper horizontal portion of the output connector 52.2 is located ina recess on the upper surface of the inductor 52 and a vertical portionof the output connector 52.2 (not shown) is formed and attached to theinductor 52 in the same way as the vertical portion of the inputconnector 52.1.

The power supply module 50 as shown in FIG. 5 will be mounted with itsupper surface to a PCB so that in a mounted state on a PCB the convertercircuit with the semiconductor chips is situated completely under theinductor.

Referring to FIGS. 6 a and 6 b, there are shown perspective top andbottom views of a substrate 60 such as that shown and designated withreference sign 51 in FIG. 5. The material of the substrate 60 may be aplastic material such as a high thermally resistant semi-rigid or rigidmaterial such as polyimide, peek, high TG epoxy resin or bismaleimide,more specifically bismaleimide-triazine BT laminate, glass reinforcedepoxy resin, PTFE, carbon and/or Kevlar reinforced resins, polyestermaterial and so on. The substrate thickness may be in the range fromabout 25 μm to about 1 mm, or may be in the range from about 25 μm toabout 250 μm, or may be in the range from about 20 μm to about 100 μm.The substrate 60 as shown in FIGS. 6 a and 6 b has the input and signalconnections all on one side of the substrate 60, namely on the uppersurface 60.1 shown in FIG. 6 a, whereas on the bottom surface 60.2 shownin FIG. 6 b is the output, which is connected directly to the inductorconnector. The substrate 60 comprises a first, high-side MOSFETtransistor 61 (Vin) and a second, low-side MOSFET transistor 62 (Gnd).On the bottom surface 60.2 of the substrate 60 an electrical contactarea 63 (L-out) is provided which is supposed to be connected directlymechanically and electrically with the inductor connector. In asynchronous buck converter the two switches, namely the twosemiconductor transistors, are both connected with one of theirrespective terminals with the inductor. In the embodiment of FIGS. 6 aand 6 b the vertical transistor chips 61 and 62 are both electricallyconnected with their back surface electrical terminals by thethrough-connections of the substrate 60 with the contact area 63. Thesubstrate 60 can be connected with its back surface 60.2 to the inductorusing solder and glue or underfill. Also possible is to use a conductivepolymer in combination with a non-conductive polymer.

The substrate 60 may comprise additional semiconductor chips like, forexample, a semiconductor chip containing a driver circuit for drivingthe converter circuit. In this case, the module would be a completepower supply module. The substrate 60 may comprise at least additionalcontact pads for connecting the module with external circuits like adriver circuit. Also the capacitor or capacitors, resistors, discretediodes etc. of the converter circuit could in principle be alsointegrated on the substrate 60.

Referring to FIG. 7, there is shown a perspective view of a power supplymodule according to an embodiment. The power supply module 70 of FIG. 7is also formed on the basis of an inductor module such as the inductormodule 50 as shown in FIG. 5. The power supply module 70 of FIG. 7comprises a substrate 71 which has a plate-like rectangular or quadraticform having two main surfaces having spatial dimensions corresponding tothe spatial dimensions of the upper surface of the inductor 72. Theinductor 72 corresponds in principle to inductor 40 of FIG. 4 but doesnot have a recess 41 a formed in the upper surface. Instead the uppersurface of the inductor 72 is plane so that the substrate 71 can beattached to it by using solder and glue or underfill or a conductivepolymer in combination with a non-conductive polymer. The inductor 72comprises a main body 72.1 made of a ferrite material, an inputconnector 72.2 and an output connector (not shown). The input connectorand the output connector can have the same form and shape as those inFIGS. 4 and 5, whereas both the input connector 72.2 and the outputconnector are arranged on the upper surface of the inductor 72 in thesame way as the output connector 43 of the inductor module 40 shown inFIG. 4, i.e., formed in a recess on the upper surface of the inductor sothat the upper surface is plane. The substrate 71 has in principle thesame structure as the substrate 51 of the power supply module 50 of FIG.5. Furthermore, the substrate 71 comprises a first, high-side MOSFETtransistor 71.1 and a second low-side MOSFET transistor 71.2. Thesubstrate 71 further comprises an output connector 71.3 which isconnected with the output connector of the inductor 72 by athrough-connection through the substrate. The substrate 71 furthercomprises additional external IC connection 71.4 which could be used fora driver IC, a controller/driver IC and/or for sense functions. Thepower supply module 70 of FIG. 7 is more complete than the power supplymodule 50 of FIG. 5 as the substrate 71 covering the entire surface ofthe inductor 72 allows the completion of the converter circuit. It isalso possible to integrate a controller and/or driver on the substrate71 which would yield a complete power supply module or a complete phaseof a multi-phase power supply module.

While the invention has been illustrated and described with respect toone or more implementations, alterations and/or modifications may bemade to the illustrated examples without departing from the spirit andscope of the appended claims. In particular regard to the variousfunctions performed by the above described components or structures(assemblies, devices, circuits, systems, etc.), the terms (including areference to a “means”) used to describe such components are intended tocorrespond, unless otherwise indicated, to any component or structurewhich performs the specified function of the described component (e.g.,that is functionally equivalent), even though not structurallyequivalent to the disclosed structure which performs the function in theherein illustrated exemplary implementations of the invention.

What is claimed is:
 1. A method comprising: providing a passivecomponent having an upper surface of a first area; and electrically andmechanically attaching a first semiconductor chip having a lower surfaceof a second area that is smaller than the first area to the passivecomponent, wherein the lower surface of the first semiconductor chip isarranged on the upper surface of the passive component, and wherein thefirst semiconductor chip comprises a vertical field-effect transistor.2. The method according to claim 1, wherein the passive componentcomprises one or more of an inductor, a capacitor, a transformer, aheatsink, a chassis component or enclosure component.
 3. The methodaccording to claim 1, further comprising arranging the firstsemiconductor chip on at least one electrical terminal of the passivecomponent.
 4. The method according to claim 3, further comprisingdirectly electrically and mechanically connecting a contact pad of thefirst semiconductor chip with the at least one electrical terminal. 5.The method according to claim 1, wherein the first semiconductor chipand the passive component are part of an electronic circuit.
 6. Themethod according to claim 1, further comprising arranging a substrate onthe upper surface of the passive component, the first semiconductor chipbeing arranged on the substrate.
 7. The method according to claim 6,wherein the substrate comprises a first surface, a second surface and aplurality of through-holes extending from the first surface to thesecond surface.
 8. The method according to claim 6, wherein thesubstrate comprises a main surface having an area smaller than or equalto the area of the upper surface of the passive component.
 9. The methodaccording to claim 6, further comprising arranging a secondsemiconductor chip on the substrate.
 10. The method according to claim9, wherein the first semiconductor chip is arranged on a first surfaceof the substrate, and wherein the second semiconductor chip is arrangedon a second surface of the substrate, the second surface situatedopposite to the first surface.
 11. The method according to claim 1,further comprising providing a recess in the upper surface of thepassive component, spatial dimensions of the recess corresponding tospatial dimensions of the first semiconductor chip or to spatialdimensions of a substrate carrying the first semiconductor chip.
 12. Themethod according to claim 11, wherein the passive component comprises atleast one electrical terminal situated below the recess.
 13. The methodaccording to claim 1, further comprising electrically coupling at leastone capacitor to the first semiconductor chip or the passive component.14. The method according to claim 13, wherein the at least one capacitorcomprises an input capacitor and an output capacitor.
 15. The methodaccording to claim 1, wherein the passive component and the firstsemiconductor chip are part of an electronic module comprising one ormore of a power supply module, a switch-mode power supply module, avoltage regulator, a DC/DC converter, a buck converter, a boostconverter, an LLC resonant converter, a TTF/ITTF converter, aphase-shifted ZVS converter, or an H4 converter.
 16. A methodcomprising: providing a passive component having an upper surface of afirst area; electrically and mechanically attaching a firstsemiconductor chip having a lower surface of a second area that issmaller than the first area to the passive component, wherein the lowersurface of the first semiconductor chip is arranged on the upper surfaceof the passive component; and electrically coupling at least onecapacitor to the first semiconductor chip or the passive component,wherein the at least one capacitor comprises an input capacitor and anoutput capacitor.
 17. The method according to claim 16, furthercomprising: arranging the first semiconductor chip on at least oneelectrical terminal of the passive component; and electrically andmechanically connecting a contact pad of the first semiconductor chipwith the at least one electrical terminal.
 18. The method according toclaim 16, further comprising providing a recess in the upper surface ofthe passive component, spatial dimensions of the recess corresponding tospatial dimensions of the first semiconductor chip or to spatialdimensions of a substrate carrying the first semiconductor chip, whereinthe passive component comprises at least one electrical terminalsituated below the recess.
 19. The method according to claim 16, furthercomprising arranging a second semiconductor chip on a substrate, whereinthe first semiconductor chip is arranged on a first surface of thesubstrate, and wherein the second semiconductor chip is arranged on asecond surface of the substrate, the second surface situated opposite tothe first surface.
 20. The method according to claim 16, furthercomprising arranging a substrate on the upper surface of the passivecomponent, the first semiconductor chip being arranged on the substrate,wherein the substrate comprises a first surface and a second surface anda plurality of through-holes extending from the first surface to thesecond surface.
 21. The method according to claim 16, further comprisingarranging a substrate on the upper surface of the passive component, thefirst semiconductor chip being arranged on the substrate, wherein thesubstrate comprises a main surface having an area smaller than or equalto the area of the upper surface of the passive component.
 22. A methodcomprising: providing a passive component having an upper surface of afirst area; electrically and mechanically attaching a semiconductor chiphaving a lower surface of a second area that is smaller than the firstarea to the passive component, wherein the lower surface of thesemiconductor chip is arranged on the upper surface of the passivecomponent; and providing a recess in the upper surface of the passivecomponent, spatial dimensions of the recess corresponding to spatialdimensions of the semiconductor chip or to spatial dimensions of asubstrate carrying the semiconductor chip, wherein the passive componentcomprises at least one electrical terminal situated below the recess.